In a landmark move to bolster U.S. semiconductor manufacturing, Taiwan Semiconductor Manufacturing Company (TSMC) has announced a $100 billion investment to construct five new facilities across the United States. This initiative, unveiled by TSMC CEO C.C. Wei alongside President Donald Trump at the White House, includes three advanced chip fabrication plants, two packaging facilities, and a significant research and development center.
The investment aims to reduce U.S. reliance on Asian semiconductor production, addressing national security concerns and strengthening domestic supply chains. President Trump emphasized the strategic importance of this development, stating, “We must be able to build the chips and semiconductors that we need right here.”
This expansion builds upon TSMC’s previous commitment of $65 billion, bringing the total U.S. investment to $165 billion. The new facilities are expected to create approximately 40,000 construction jobs over the next four years, significantly boosting local economies.
However, this strategic shift has raised concerns in Taiwan, as moving critical R&D activities abroad could potentially weaken the island’s strategic advantage against geopolitical pressures.